An analysis about the comp村水etition pattern of Chinas i請電ntegrated circui紙商t packing industry in the yea小歌r 2012
Integrated circuit package no畫門t only plays a role in an internal chi議遠p bonding and in 飛機external electrical connection ,but 為技also provides a stable 件謝and reliable working environmen暗跳t for integrated circuit國站 chip and a mechanical術頻 or environmental protection for in如風tegrated circuit chip.Thus the in子購tegrated circuit 外音chip can function proper答厭ly and ensure that it has high sta朋藍bility and reliability. In sho窗睡rt, the packaging quality of integr紙章ated circuits has great influence o月小n the overall performance of the int如山egrated circuit. There放資fore, the package shoud have stro做師ng mechanical per醫很formance, good electri費服cal performance, heat resistance and 國吧chemical stability performan車還ce.
Although the ICs difference in路會 physical structure, the applicati多海on field and the number of 體生I/O is very big, the difference in the 司來role and function of the IC package 可身is not so significant ,In addition,女雨the purpose of packaging is&nbs大個p; prettty consistent.As the pro算電tector of the chip, pac影門kage plays several roles. To sum up, 鐵雜there are two main fun也票damental roles .
(1) Protect the chip from p都老hysical damage;
(2) Redistribute I筆微/O and obtain pi畫煙n pitch more easily handl計唱ed in assembly. Pac嗎船akge plays other minor roles農玩 such as providing a more easily sta我一ndardized structure,兒朋 providing cooling channel for t西短he chip, protec跳會ting the chip from 煙鐘avoiding errors 美物caused by soft particles 但話and providing a more convenient化坐 structure for tes女舊ting and aging test樹時.
The package can also be use房低d to interconnect multiple IC樂去. It can directly make interco關來nnection using standard wi和區re bonding techn去農ology,or can also use美村 interconnecting p坐黃athways provided b輛亮y packaging, such as慢議 hybird packaging生分 technology,multichip module道內,system level packaging , 好低the borad system minia亮頻turation and interconnection pa村你thways included in interconnecting 區不methods. WIth the de近樂velopment of microelectronic and線友 laboratory device on線事 chip, packaging plays a greate熱微r role, such as puttin商著g restrictions on the 美山contact of the chip with the outsi吃動de world, meeting the pressure r熱見equirements and require場兵ments of the chemistry and呢遠 atmosphere environm水醫ent. People pay more and more白道 attention and do research o少煙n packaging in order to meet the體家 requirements of 愛數the continous development of t報行he important area. Great市商 changes have ta作男ken place in rece土物nt years in the importance and functi影微on of packaging. I購河C packaging has becom請月e a field as impor花人tant as itself. Thi喝要s is because in many雨舊 cases, the perform兒熱ance of IC is restricte筆筆d by ICs package. Therefore, peopl遠銀e pay more and more attention to訊說 the development of IC packagin南畫g technology to meet new challe開玩nges.
The competition pattern of 門車packaging industry all over the worl裡我d
Along with the growt光習h and development of the integ我對rated circuit industry,IC packaging i動車ndustry and other industri飛冷es have gone throu體視gh the continous process o科裡f industrial transfer關南 in the world. Integ話木rated circuit pac地書kaging industry began in the影物 nineteen sixties, is now transferrring讀員 from the developed countri話中es in Europe and America to the coun木女tries in Asia Pacific r人哥egion. At present, countries為讀 or regions &nbs銀藍p;mainly engaged in 短水semiconductor packagi他呢ng are Chinas Taiwan, mainland Ch制這ina, Singapore, Japan and the Uni拿時ted States of America. Chin師河as Taiwan region made its fortun能筆e from the integrated circu金老it pacakge and occupie放用s now a leading p車市osition in the global IC packagi計票ng industry. In the annual top 站國10 global packaging companies of 書土the year 2010, Taiwan enterprises occ黃嗎upy 5 seats.
The competition pattern of見北 the domestic pack坐員aging industry
As the electron這對- terminal -market s application v低林alue in Chinese domestic m坐得arket is huge a線訊nd fast growing,internat銀體ional semi-conductor ma可長nufacturers ,assembly and來好 test foundry e農分nterprises have moved their packag錢低ing production to 窗書China in order to reduce the pr友資oduction cost,dir算舊ectly stimulating the rapid expansio街個n of Chinas semi-conductor 鐵和packaging industry.
At present, the majo火嗎r global IDM manufa男相cturers and profession市站al packaging and testing plan男雜ts have built u藍鐘p production ba票技se in mainland China, w在媽hich resulted in foreig有一n funded packaging an分匠d testing enterprises prope草聽rtion being very high . At the same t司作ime, after many years efforts相用, packaging enterpri為少ses of Chinas domestic and domestic ho空吧ldings enterprises have made r門慢apid developmen跳制ts and are gradually narrowing the 舊術gaps with the international manufac兵匠turers in the technology and market. 答樂Part of the domestic pac村計kaging and testing companies費森 such as ChangDian electronics tec技信hnology ,TongFu 女山micro electrical, HuaTian Technology 個謝etc have issued stocks身你 in the domestic stock marke喝冷t.
